长垣产业园区科技文献服务平台
主页
文献资源
外文期刊
外文会议
中文期刊
专业机构
起重机械
智能制造
高级检索
关于我们
版权声明
使用帮助
期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
全部
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2017, vol.139, no.1
2017, vol.139, no.2
2017, vol.139, no.3
2017, vol.139, no.4
题名
作者
出版年
年卷期
Ball Grid Array Interconnection Properties of Solderable Polymer-Solder Composites With Low-Melting-Point Alloy Fillers
Shin, Young-Eui; Yim, Byung-Seung; Kim, Jong-Min
2017
2017, vol.139, no.4
Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
Takahashi, Yasuo; Fukuda, Hiroki; Yoneshima, Yasuhiro; Kitamura, Hideki; Maeda, Masakatsu
2017
2017, vol.139, no.4
Effectiveness of Rack-Level Fans-Part I: Energy Savings Through Consolidation
Nagendran, Bharath; Mulay, Veerendra; Agonafer, Dereje; Eiland, Richard; Fernandes, John Edward
2017
2017, vol.139, no.4
Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
Hsieh, Chi-Lung; Kung, Huang-Kuang
2017
2017, vol.139, no.4
Effectiveness of Rack-Level Fans-Part II: Control Strategies and System Redundancy
Fernandes, John Edward; Eiland, Richard; Nagendran, Bharath; Mulay, Veerendra; Agonafer, Dereje
2017
2017, vol.139, no.4
Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air Supply
Wang, Cheng-Hao; Tsui, Yeng-Yung; Wang, Chi-Chuan
2017
2017, vol.139, no.4
Determination of Energy Release Rate Through Sequential Crack Extension
McCann, Scott; Ostrowicki, Gregory T.; Anh Tran; Huang, Timothy; Bernhard, Tobias; Tummala, Rao R.; Sitaraman, Suresh K.
2017
2017, vol.139, no.4
Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions
Eiland, Richard; Fernandes, John Edward; Vallejo, Marianna; Siddarth, Ashwin; Agonafer, Dereje; Mulay, Verrendra
2017
2017, vol.139, no.4
Ultraminiaturized Three-Dimensional IPAC Packages With 100 mu m Thick Glass Substrates for Radio Frequency Front-End Modules
Wu, Zihan; Min, Junki; Smet, Vanessa; Pulugurtha, Markondeya Raj; Sundaram, Venky; Tummala, Rao R.
2017
2017, vol.139, no.4
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu Microbumps
Shin, Chanho; Kim, Young-Ho; Ma, Sung Woo
2017
2017, vol.139, no.4
1
2
3
4
5
国家科技图书文献中心
全球文献资源网
京ICP备05055788号-26
机械工业信息研究院 2018-2024