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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
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1995~2024
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2016, vol.138, no.1
2016, vol.138, no.2
2016, vol.138, no.3
2016, vol.138, no.4
题名
作者
出版年
年卷期
Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature
Pearson, Matthew R.; Lents, Charles E.
2016
2016, vol.138, no.4
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
Brunschwiler, Thomas; Zurcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Burg, Brian; Zimmermann, Severin; Zschenderlein, Uwe; Wunderle, Bernhard; Schindler-Saefkow, Florian; Stassle, Rahel
2016
2016, vol.138, no.4
A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
Chen, Cheng; Geer, James; Sammakia, Bahgat
2016
2016, vol.138, no.4
Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
Gess, Joshua; Bhavnani, Sushil; Johnson, R. Wayne
2016
2016, vol.138, no.4
Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid-Solid Reaction Couples
Hsu, Shou-Jen; Lee, Chin C.
2016
2016, vol.138, no.4
Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
Zhu, Yan; Sun, Fenglian
2016
2016, vol.138, no.4
Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials
Feng, Dudong; Yao, Shi-Chune; Zhang, Tian; Zhang, Qiming
2016
2016, vol.138, no.4
Modular Microfluidic Filters Based on Transparent Membranes
Archibong, E.; Tuazon, H.; Wang, H.; Winskas, J.; Pyayt, A. L.
2016
2016, vol.138, no.4
Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
Kallolimath, Sharan; Zhou, Jiang Jenny
2016
2016, vol.138, no.4
Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
Mahan, Kenny; Rosen, David; Han, Bongtae
2016
2016, vol.138, no.4
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