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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2013, vol.135, no.1
2013, vol.135, no.2
2013, vol.135, no.3
2013, vol.135, no.4
题名
作者
出版年
年卷期
Investigation on Laser Direct Welding of Quad Flat Pack Components
Jianwen Yuan; Chao Huang; Jimin Chen; Furong Liu; Yi Qiu
2013
2013, vol.135, no.4
Experimental and Modeling Studies of Looping Process for Wire Bonding
Fuliang Wang; Yun Chen
2013
2013, vol.135, no.4
A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions
Bo Tao; Guanghua Wu; Zhouping Yin; Youlun Xiong
2013
2013, vol.135, no.4
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
Guofeng Xia; Fei Qin; Cha Gao; Tong An; Wenhui Zhu
2013
2013, vol.135, no.4
Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias
Anjali Chauhan; Bahgat Sammakia; Furat F. Afram; Kanad Ghose; Gamal Refai-Ahmed; Dereje Agonafer
2013
2013, vol.135, no.4
Hygromechanical Analysis of Liquid Crystal Display Panels
Toru Ikeda; Tomonori Mizutani; Kiyoshi Miyake; Noriyuki Miyazaki
2013
2013, vol.135, no.4
Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
Fuliang Wang; Weidong Tang; Junhui Li; Lei Han
2013
2013, vol.135, no.4
Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode
Yi Yan; Youliang Guan; Xu Chen; Guo-Quan Lu
2013
2013, vol.135, no.4
A Stepped-Bar Apparatus for Thermal Resistance Measurements
Dakotah R. Thompson; Sameer R. Rao; Baratunde A. Cola
2013
2013, vol.135, no.4
Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules
Se-Chang Kim; Dae-Geun Cho; Tae-Gyu Kim; Se-Hun Jung; Ja-Choon Koo; Moon-Ki Kim; Jae-Boong Choi
2013
2013, vol.135, no.4
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