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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2012, vol.134, no.1
2012, vol.134, no.2
2012, vol.134, no.3
2012, vol.134, no.4
题名
作者
出版年
年卷期
Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
Gongnan Xie; Jian Liu; Weihong Zhang; Bengt Sunden
2012
2012, vol.134, no.4
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Thomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash; Niru Kumari; Tahir Cader
2012
2012, vol.134, no.4
Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
Da Yu; Hohyung Lee; Seungbae Park
2012
2012, vol.134, no.4
Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
D. N. Borza; I. T. Nistea
2012
2012, vol.134, no.4
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Thomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash; Brandon Rubenstein; Scot Heath; Niru Kumari
2012
2012, vol.134, no.4
Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
A. F. M. Arif; Syed M. Zubair; S. Pashah
2012
2012, vol.134, no.4
Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers
Dae Hee Lee; Jong Ryeol Bae; Mira Ryu; Phil Ligrani
2012
2012, vol.134, no.4
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
Yi Yan; Xu Chen; Xingsheng Liu; Yunhui Mei; Guo-Quan Lu
2012
2012, vol.134, no.4
Pull Force and Displacement of Cu/Au Wire Interconnects
J. Lau; S. Wu; J. M. Lau
2012
2012, vol.134, no.4
Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling
Ercan M. Dede
2012
2012, vol.134, no.4
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