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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2010, vol.132, no.1
2010, vol.132, no.2
2010, vol.132, no.3
2010, vol.132, no.4
题名
作者
出版年
年卷期
Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly
M. Mastrangeli; K. Jans; T. Steylaerts; C. Van Hoof; J. P. Celis
2010
2010, vol.132, no.4
Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
Ken-ichi Ohguchi; Katsuhiko Sasaki
2010
2010, vol.132, no.4
An Investigation of Flat-Plate Oscillating Heat Pipes
Peng Cheng; Scott Thompson; Joe Boswell; H. B. Ma
2010
2010, vol.132, no.4
On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
Wuwei Feng; Qingfeng Meng; Youbo Xie; Hong Fan
2010
2010, vol.132, no.4
Thermal Conductivity of Diamond-Containing Grease
Hung-En Chou; Shang-Ray Yang; Sea-Fue Wang; James C. Sung
2010
2010, vol.132, no.4
Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates
K. N. Prabhu; G. Kumar
2010
2010, vol.132, no.4
Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Jianhua Zhang; Jinsong Zhang; Lianqiao Yang
2010
2010, vol.132, no.4
Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
Ken-ichi Ohguchi; Katsuhiko Sasaki
2010
2010, vol.132, no.4
Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding
M. F. Rosle; S. Abdullah; M. A. A. Hamid; A. R. Daud; A. Jalar; Z. Kornain
2010
2010, vol.132, no.4
Successive Softening and Cyclic Damage in Viscoplastic Material
Leila J. Ladani
2010
2010, vol.132, no.4
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