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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
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1995~2024
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2009, vol.131, no.1
2009, vol.131, no.2
2009, vol.131, no.3
2009, vol.131, no.4
题名
作者
出版年
年卷期
The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps
Jose Omar S. Amistoso; Alberto V. Amorsolo, Jr.
2009
2009, vol.131, no.4
The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface
Dominiek Degryse; Bart Vandevelde; Eric Beyne; Joris Degrieck
2009
2009, vol.131, no.4
Measurement of Leak Rate for MEMS Vacuum Packaging
Zhiyin Gan; Dexiu Huang; Xuetang Wang Dong Lin; Sheng Liu
2009
2009, vol.131, no.4
Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites
Jun Zeng; Renli Fu; Simeon Agathopoulos; Shaodong Zhang; Xiufeng Song; Hong He
2009
2009, vol.131, no.4
A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks
Chuen-Ching Wang; Wen-Ran Yang; Jin-Jia Chen; Wei-Wen Shi
2009
2009, vol.131, no.4
Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
Wan Ho Song; Ali Karimi; Yan Huang; Michael Mayer; Norman Zhou; Jae Pil Jung
2009
2009, vol.131, no.4
Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock
A. D. Laws; R. Berwick III; P. Stupar; J. DeNatale; Y. C. Lee
2009
2009, vol.131, no.4
Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
D. Bhate; G. Subbarayan; J. Zhao; V. Gupta; D. Edwards
2009
2009, vol.131, no.4
A Novel Ceramic Packaging Technique Using Selective Induction Heating
Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen
2009
2009, vol.131, no.4
Novel Design of Thermal-Via Configurations for Collector-Up HBTs
Pei-Hsuan Lee; Hsien-Cheng Tseng; Jung-Hua Chou
2009
2009, vol.131, no.4
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