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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
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1995~2024
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2005, vol.127, no.1
2005, vol.127, no.2
2005, vol.127, no.3
2005, vol.127, no.4
题名
作者
出版年
年卷期
Design Optimization for Pin-Fin Heat Sinks
Han-Ting Chen; Po-Li Chen; Jenn-Tsong Horng; Ying-Huei Hung
2005
2005, vol.127, no.4
A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
Satish Radhakrishnan; Ganesh Subbarayan; Luu Nguyen; William P. Mazotti
2005
2005, vol.127, no.4
A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading
Yutaka Tsukada; Hideo Nishimura; Hiroki Yamamoto; Masao Sakane
2005
2005, vol.127, no.4
Time-Dependent Rheological Behavior of Fluids For Electronics Packaging
X. B. Chen
2005
2005, vol.127, no.4
Behavior of Anisotropic Conductive Film (ACF) Joint Under Mechanical Shock
Rashed Adnan Islam; Y. C. Chan
2005
2005, vol.127, no.4
Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis
Qian Zhang; Abhijit Dasgupta; Dave Nelson; Hector Pallavicini
2005
2005, vol.127, no.4
Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy
M. N. Islam; Y. C. Chan; M. O. Alam; A. Sharif
2005
2005, vol.127, no.4
A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks
Weilin Qu; Issam Mudawar
2005
2005, vol.127, no.4
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
K. M. B. Jansen; V. Gonda; L. J. Ernst; H. J. L. Bressers; G. Q. Zhang
2005
2005, vol.127, no.4
Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn-36%Pb-2%Ag Solder Ball Arrays in Commercial Area Array Packages at -40℃, 23℃, and 125℃
Ahmad Abu Obaid; Jay G. Sloan; Mark A. Lamontial; Antonio Paesano; Subhotosh Khan; John W. Gillespie, Jr.
2005
2005, vol.127, no.4
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