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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2003, vol.125, no.1
2003, vol.125, no.2
2003, vol.125, no.3
2003, vol.125, no.4
题名
作者
出版年
年卷期
Effect of Bonding Force on the Conducting Particle With Different Sizes
N. H. Yeung; Y. C. Chan; C. W. Tan
2003
2003, vol.125, no.4
3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
John H. Lau; Stephen H. Pan
2003
2003, vol.125, no.4
Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface
Tan Chee Wei; Abdul Razak Daud
2003
2003, vol.125, no.4
Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles
G. B. Dou; Y. C. Chan; Johan Liu
2003
2003, vol.125, no.4
Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
John H. Lau; Steve Erasmus; Yida Zou
2003
2003, vol.125, no.4
Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects
R. T. P. Lee; A. S. Zuruzi; S. K. Lahiri
2003
2003, vol.125, no.4
Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
Victor Adrian Chiriac; Tien-Yu Tom Lee
2003
2003, vol.125, no.4
Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion
X. J. Zhao; G. Q. Zhang; J. F. J. M. Caers; L. J. Ernst
2003
2003, vol.125, no.4
Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging
Chang-An Yuan; Kou-Ning Chiang
2003
2003, vol.125, no.4
Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element
A. A. O. Tay; K. H. Lee; K. M. Lim
2003
2003, vol.125, no.4
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