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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2002, vol.124, no.1
2002, vol.124, no.2
2002, vol.124, no.3
2002, vol.124, no.4
题名
作者
出版年
年卷期
Transient Thermal Management of a Handset Using Phase Change Material (PCM)
Marc Hodes; Randy D. Weinstein; Stephen J. Pence; Jason M. Piccini; Lou Manzione; Calvin Chen
2002
2002, vol.124, no.4
Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications
Mudasir Ahmad; Suresh K. Sitaraman
2002
2002, vol.124, no.4
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
J. Lau; Z. Mei; S. Pang; C. Amsden; J. Rayner; S. Pan
2002
2002, vol.124, no.4
Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
C. W. Tang; Y. C. Chan; K. C. Hung; P. L. Tu
2002
2002, vol.124, no.4
An Analytical Cure Model for Underfill Epoxies
R. L. Mahajan; C. P. Malhotra; R. K. Sharma
2002
2002, vol.124, no.4
Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae
2002
2002, vol.124, no.4
Corrosion Analysis of a Fiber-Optic Transceiver Housing
J. H. Lau; C. L. Jiaa; S. J. Erasmus
2002
2002, vol.124, no.4
Impact Resistance of SM Joints Formed With ICA
C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung
2002
2002, vol.124, no.4
Study of P-V-T-C Relation of EMC
Yi-San Chang; Sheng-Jye Hwang; Huei-Huang Lee; Durn-Yuan Huang
2002
2002, vol.124, no.4
Electrically Conductive Adhesive Formulations for SMT Applications
Ryszard Kisiel
2002
2002, vol.124, no.4
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