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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2001, vol.123, no.1
2001, vol.123, no.2
2001, vol.123, no.3
2001, vol.123, no.4
题名
作者
出版年
年卷期
A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips
Boris Mirman; Emanuel Bobrov
2001
2001, vol.123, no.4
Adhesion and Reliability of Epoxy/Glass Interfaces
John E. Ritter; Armin Huseinovic
2001
2001, vol.123, no.4
A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load
Ron S. Li
2001
2001, vol.123, no.4
Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly
Ruijun Chen; Daniel F. Baldwin
2001
2001, vol.123, no.4
Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys-Experiments and Constitutive Modeling
Katsuhiko Sasaki; Ken-ichi Ohguchi; Hiromasa Ishikawa
2001
2001, vol.123, no.4
Thermal Math Modeling and Analysis of an Electronic Assembly
K. N. Shukla
2001
2001, vol.123, no.4
Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept
Dagmar Beyerlein; Lee E. Hornberger
2001
2001, vol.123, no.4
Experimental Evaluation of Air-Cooling Electronics at High Altitudes
Henry Wong; Robert E. Peck
2001
2001, vol.123, no.4
Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder
V. Stolkarts; L. M. Keer; M. E. Fine
2001
2001, vol.123, no.4
Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design
Mohamed-Nabil Sabry
2001
2001, vol.123, no.4
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