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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2000, vol.122, no.1
2000, vol.122, no.2
2000, vol.122, no.3
2000, vol.122, no.4
题名
作者
出版年
年卷期
Software "Reliability"?
Robert S. Hanmer
2000
2000, vol.122, no.4
Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat Sinks
W. W. Thrasher; T. S. Fisher; K. E. Torrance
2000
2000, vol.122, no.4
A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures
J. H. Ong; G. H. Lim
2000
2000, vol.122, no.4
Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies
Reza Ghaffarian
2000
2000, vol.122, no.4
An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
S. M. Heinrich; S. Shakya; J. Liang; P. S. Lee
2000
2000, vol.122, no.4
Thermal Management of Surface Mount Power Magnetic Components
G. Refai-Ahmed; M. M. Yovanovich
2000
2000, vol.122, no.4
Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
T. Elperin; A. Kornilov; G. Rudin
2000
2000, vol.122, no.4
Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis
John H. Lau; S.-W. Ricky Lee; Chris Chang
2000
2000, vol.122, no.4
Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills
John H. Lau; S.-W. Ricky Lee
2000
2000, vol.122, no.4
Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages
A. Q. Xu; H. F. Nied
2000
2000, vol.122, no.4
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