长垣产业园区科技文献服务平台
主页
文献资源
外文期刊
外文会议
中文期刊
专业机构
起重机械
智能制造
高级检索
关于我们
版权声明
使用帮助
期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
全部
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
1999, vol.121, no.1
1999, vol.121, no.2
1999, vol.121, no.3
1999, vol.121, no.4
题名
作者
出版年
年卷期
Three-dimensional effects of solder joints in micro-scale BGA assembly
J. Zhu
1999
1999, vol.121, no.4
Thermomechanical durability analysis of flip chip solder interconnects: part 2--with underfill
K. Darbha; J. H. Okura; S. Shetty; A. Dasgupta; T. Reinikainen; J. Zhu; J. F. J. M. Caers
1999
1999, vol.121, no.4
Thermomechanical durability analysis of flip chip solder interconnects: part 1--without underfill
K. Darbha; J. H. Okura; A. Dasgupta
1999
1999, vol.121, no.4
Thermoelastic modeling of a PWB with simulated circuit traces subjected to infrared reflow soldering with experimental validation
Y. Polsky; I. C. Ume
1999
1999, vol.121, no.4
Thermal management in direct chip attach assemblies
D. F. Baldwin; J. T. Beerensson
1999
1999, vol.121, no.4
Surface graft copolymerization enhanced lamination of poly(tetrafluoroethylene) film to copper and epoxy-based print circuit board (PCB)
J. Zhang; C. Q. Cui; T. B. Lim; E. T. Kang
1999
1999, vol.121, no.4
Modeling of the mechanical behavior of materials in "high-tech" systems: attributes and review
E. Suhir
1999
1999, vol.121, no.4
Investigation of a new lead free solder alloy using thin strip specimens
W. Ren; Z. Qian; M. Lu; S. Liu; D. Shangguan
1999
1999, vol.121, no.4
Flow-field prediction in submerged and confined jet impingement using the Reynolds stress model
G. K. Morris; S. V. Garimella; J. A. Fitzgerald
1999
1999, vol.121, no.4
Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array packages
J. Lau; T. Chen; S. -W. R. Lee
1999
1999, vol.121, no.4
1
2
3
4
5
国家科技图书文献中心
全球文献资源网
京ICP备05055788号-26
机械工业信息研究院 2018-2024