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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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1998, vol.120, no.2
1998, vol.120, no.3
1998, vol.120, no.4
题名
作者
出版年
年卷期
The effect of underfill and underfill delamination on the thermal stress in flip-chip solder joints
S. Rzepka; M. A. Korhonen; E. Meusel; C. -Y. Li
1998
1998, vol.120, no.4
Reliability of underfill-encapsulated flip-chips with heat spreaders
H. Doi; K. Kawano; A. Yasukawa; T. Sato
1998
1998, vol.120, no.4
Potential failure sites in a flip-chip package with and without underfill
E. Madenci; S. Shkarayev; R. Mahajan
1998
1998, vol.120, no.4
Measurement of interfacial fracture toughness under combined mechanical and thermal stresses
J. Jiao; C. K. Gurumurthy; E. J. Kramer; Y. Sha; C. Y. Hui; P. Borgesen
1998
1998, vol.120, no.4
Experimental study on electric-current induced damage evolution at the crack tip in thin film conductors
A. -F. Bastawros; K. -S. Kim
1998
1998, vol.120, no.4
Direct measurement of the adhesive fracture resistance of CVD diamond particles
S. Kamiya; H. Takahashi; M. Saka; H. Abe
1998
1998, vol.120, no.4
Cooling rate effect on post cure stresses in molded plastic IC packages
S. Yi; K. Y. Sze
1998
1998, vol.120, no.4
Adhesion and reliability of polymer/inorganic interfaces
S. -Y. Kook; J. M. Snodgrass; A. Kirtikar; R. H. Dauskardt
1998
1998, vol.120, no.4
A thermo-mechanical approach for fatigue testing of polymer bimaterial interfaces
C. K. Gurumurthy; J. Jiao; L. G. Norris; G. -Y. Hui; E. J. Kramer
1998
1998, vol.120, no.4
A thermodynamic framework for damage mechanics of solder joints
C. Basaran; C. -Y. Yan
1998
1998, vol.120, no.4
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