长垣产业园区科技文献服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

1997, vol.119, no.1 1997, vol.119, no.3 1997, vol.119, no.4

题名作者出版年年卷期
Z-axis anisotropic electrically conducting polymer-matrix composite filmL. Li; D. D. L. Chung19971997, vol.119, no.4
Wire-sweep study using an industrial semiconductor-chip-encapsulation operationS. Han; K. K. Wang; D. L. Crouthamel19971997, vol.119, no.4
Transient response of microchannel heat sinks in silicon waferJ. R. Rujano; M. M. Rahman19971997, vol.119, no.4
Thermomechanical response of materials and interfaces in electronic packaging: part II -- unified constitutive model and validation, and designC. S. Desai; J. Chia; T. Kundu; J. L. Prince19971997, vol.119, no.4
Thermomechanical response of materials and interfaces in electronic packaging: part I -- unified constitutive model and calibrationC. S. Desai; J. Chia; T. Kundu; J. L. Prince19971997, vol.119, no.4
The impact of interfacial adhesion on PTH and via stress stateG. Subbarayan; K. Ramakrishna; B. G. Sammakia19971997, vol.119, no.4
Residual stress analysis of bimaterial strips under multiple thermal loadingJ. W. Tierney; J. W. Eischen19971997, vol.119, no.4
Prediction of solder geometry for an axisymmetric through-hole jointA. F. Elkouh; N. Ramasubramanian; T. F. Hsu; N. J. Nigro; S. M. Heinrich; P. S. Lee; D. Shangguan19971997, vol.119, no.4
Improved analytical estimate of global CTE mismatch displacement in areal-array solder jointsS. M. Heinrich; S. Shakya; P. S. Lee19971997, vol.119, no.4
Fatigue life predictions for thermally loaded solder joints using a volume-weighted averaging techniqueH. U. Akay; N. H. Paydar; A. Bilgic19971997, vol.119, no.4
1234



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024