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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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1996, vol.118, no.1
1996, vol.118, no.2
1996, vol.118, no.3
1996, vol.118, no.4
题名
作者
出版年
年卷期
Vibration induced fatigue life estimation of corner leads of peripheral leaded components
Sidharth; D. B. Barker
1996
1996, vol.118, no.4
Transient modeling of the thermal behavior of outdoor electronic cabinets
Eric B. Zimmerman; Gene T. Colwell
1996
1996, vol.118, no.4
Life prediction of solder joints by damage and fracture mechanics
S. H. Ju; B. I. Sandor; M. E. Plesha
1996
1996, vol.118, no.4
Experimental investigation of the formation of surface mount solder joints
P. P. Conway; M. R. Kalantary; D. J. Williams
1996
1996, vol.118, no.4
Efficient heat transfer approximation for the chip-on-substrate problem
Timothy S. Fisher; F. A. Zell; Kamal K. Sikka; Kenneth E. Torrance
1996
1996, vol.118, no.4
Development of an integrated design system for thermal reliability prediction of SMT solder interconnects
Y. -H. Pao; E. Jih; V. Siddapureddy
1996
1996, vol.118, no.4
Calculation of forced-air cooling of electronic modules with a two-fluid model of turbulence
O. J. Ilegbusi
1996
1996, vol.118, no.4
Ball grid array thermomechanical response during reflow assembly
T. E. Voth; T. L. Bergman
1996
1996, vol.118, no.4
Analysis and modeling of lead coplanarity distributions
E. K. Buratynski
1996
1996, vol.118, no.4
An ultra-high power two-phase jet-impingement avionic clamshell module
Murray E. Johns; Issam Mudawar
1996
1996, vol.118, no.4
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