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期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告：硅器件和材料
收藏年代2000～2023



全部

2000 2001 2002 2009 2013 2014
2015 2017 2020 2021 2022 2023

2001, vol.101, no.107 2001, vol.101, no.108 2001, vol.101, no.246 2001, vol.101, no.247 2001, vol.101, no.320 2001, vol.101, no.321
2001, vol.101, no.350 2001, vol.101, no.430 2001, vol.101, no.515 2001, vol.101, no.571 2001, vol.101, no.573 2001, vol.101, no.718
2001, vol.101, no.719

题名作者出版年年卷期
Metal capped copper interconnection technology using preferential deposition phenomenon of W-CVDTatsuyuki Saito; Toshinori Imai; Junji Noguchi; Maki Kubo; Yuko Ito; Sohei Omori; Naofumi Ohashi; Tsuyoshi Tamaru; Hizuru Yamaguchi20012001, vol.101, no.430
Two-step copper electroplating technique using seed enhancement stepNobuki Hosoi; Ryoichi Kimizuka; Mizuki Nagai; Shuichi Okuyama; Takeshi Kobayashi; Nobukazu Ito; Koji Arita; Hidenobu Miyamoto20012001, vol.101, no.430
Development of Cu CMP process with Cu abrasive free polishing technologyNaohumi Ohashi; Youhei Yamada; Nobuhiro Konisi; Hiroyuki Maruyama; Takahumi Ohshima; Hizuru Yamaguchi; Akira Satoh20012001, vol.101, no.430
Preparation of low dielectric constant a-C:F films for ULSI intermetal dielectrics by PECVDN. Haneji; Y. Shimogaki; Y. Nakano20012001, vol.101, no.430
Low-k organic polymer deposition technique and its application with plasma polymerization methodJun Kawahara; Munehiro Tada; Hiroto Ohtake; Yoshimichi Harada; Masayoshi Tagami; Masayuki Hiroi; Keizo Kinoshita; Shinobu Saito; Takahiro Onodera; Naoya Furutake; Yoshihiro Hayashi20012001, vol.101, no.430
Analysis of mechanical strength of low k dielectricsNobuo Aoi; Takuya Fukuda; Hiroshi Yanazawa20012001, vol.101, no.430
Stacked peel-off phenomena on Cu-damascene process using low-k MSQ dielectricYoshiaki Shimooka; Seiichi Satoh; Kazuyuki Higashi; Noriaki Matsunaga; Hideshi Miyajima; Hideki Shibata20012001, vol.101, no.430
Copper and CVD SiOC/SiC integration technologyMichio Aruga; Keiji Horioka; Nobuo Owada20012001, vol.101, no.430
GHz clock distribution circuit in Si ULSI: comparison of distributed RC line and transmission lineHou Wan Chan; Tomohito Tsushima; Yoshiato Yokoyama; Kazuya Masu20012001, vol.101, no.430



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