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期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2005, vol.16, no.1 2005, vol.16, no.10 2005, vol.16, no.11-12 2005, vol.16, no.2 2005, vol.16, no.3 2005, vol.16, no.4
2005, vol.16, no.5 2005, vol.16, no.6 2005, vol.16, no.7 2005, vol.16, no.8 2005, vol.16, no.9

题名作者出版年年卷期
Ferromagnetism of ZnO and GaN: A ReviewC. LIU; F. YUN; H. MORKOC20052005, vol.16, no.9
Electrical properties of stacked CuInSe{sub}2 thin filmsA. ASHOUR; A. A. AKL; A. A. RAMADAN; K. ABD EL-HADY20052005, vol.16, no.9
Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal agingDAE-GON KIM; HYUNG-SUN JANG; JONG-WOONG KIM; SEUNG-BOO JUNG20052005, vol.16, no.9
The influence of temperature hysteresis at metal-semiconductor phase transition on current-voltage characteristic of VO{sub}2-based ceramicsA. I. IVON; V. R. KOLBUNOV; I. M. CHERNENKO20052005, vol.16, no.9
Anneal induced recrystallization of CdTe films electrodeposited on stainless steel foil: The effect of CdCl{sub}2J. P. ENRIQUEZ; X. MATHEW20052005, vol.16, no.9
Structures and dielectric properties of La/Sn co-substituted Ba{sub}4Nd{sub}2Ti{sub}4Ta{sub}6O{sub}30 ceramicsX. H. ZHENG; X. M. CHEN; T. WANG20052005, vol.16, no.9
Semi-abrasive free slurry with acid colloidal silica for copper chemical mechanical planarizationNAM-HOON KIM; JONG-HEUN LIM; SANG-YONG KIM; EUI-GOO CHANG20052005, vol.16, no.9



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