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期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2007, vol.18, no.10 2007, vol.18, no.11 2007, vol.18, no.12 2007, vol.18, no.1-3 2007, vol.18, no.1sup 2007, vol.18, no.4
2007, vol.18, no.5 2007, vol.18, no.6 2007, vol.18, no.7 2007, vol.18, no.8 2007, vol.18, no.9

题名作者出版年年卷期
Stress analysis of spontaneous Sn whisker growthK. N. Tu; Chih Chen; Albert T. Wu20072007, vol.18, no.1-3
Life expectancies of Pb-free SAC in electronic hardwareMichael Osterman; Abhijit Dasgupta20072007, vol.18, no.1-3
Impact of the ROHS directive on high-performance electronic systems - Part I: need for lead utilization in exempt systemsKarl J. Puttlitz; George T. Galyon20072007, vol.18, no.1-3
Impact of the ROHS Directive on high-performance electronic systems - Part II: key reliability issues preventing the implementation of lead-free soldersKarl J. Puttlitz; George T. Galyon20072007, vol.18, no.1-3
Issues related to the implementation of Pb-free electronic solders in consumer electronicsD. R. Frear20072007, vol.18, no.1-3
Sn-whiskers: truths and mythsJ. W. Osenbach; J. M. DeLucca; B. D. Potteiger; A. Amin; F. A. Baiocchi20072007, vol.18, no.1-3
Tin pest issues in lead-free electronic soldersW. J. Plumbridge20072007, vol.18, no.1-3
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packagesSeung-Hyun Chae; Xuefeng Zhang; Kuan-Hsun Lu; Huang-Lin Chao; Paul S. Ho; Min Ding; Peng Su; Trent Uehling; Lakshmi N. Ramanathan20072007, vol.18, no.1-3
Electromigration issues in lead-freeChih Chen; S. W. Liang20072007, vol.18, no.1-3
Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environmentsK. N. Subramanian20072007, vol.18, no.1-3
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