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期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2012, vol.23, no.1 2012, vol.23, no.10 2012, vol.23, no.11 2012, vol.23, no.12 2012, vol.23, no.2 2012, vol.23, no.3
2012, vol.23, no.4 2012, vol.23, no.5 2012, vol.23, no.6 2012, vol.23, no.7 2012, vol.23, no.8 2012, vol.23, no.9

题名作者出版年年卷期
The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al_2O_3 composite solder/Cu interface during soldering reactionS. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen20122012, vol.23, no.1
Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resinXiaojian Yang; Wei He; Shouxu Wang; Guoyun Zhou; Yao Tang20122012, vol.23, no.1
Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frameA. Haque; B. H. Lim; A. S. M. A. Haseeb; H. H. Masjuki20122012, vol.23, no.1
Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder jointsChun Yu; Yang Yang; Kaiyun Wang; Jijin Xu; Junmei Chen; Hao Lu20122012, vol.23, no.1
Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solderG. Q. Wei; Y. L. Huang20122012, vol.23, no.1
Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile testYanhong Tian; Wei Liu; Rong An; Wei Zhang; Lina Niu; Chunqing Wang20122012, vol.23, no.1
Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder jointsCuiping Wu; Jun Shen; Changfei Peng20122012, vol.23, no.1
Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solderMingna Wang; Jianqiu Wang; Hao Feng; Wei Ke20122012, vol.23, no.1
Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloysJun Shen; Cuiping Wu; Shizeng Li20122012, vol.23, no.1
Effects of annealing temperatures on crystalline quality of ceramic thin films by RF-magnetron sputtering using Zn-enriched (Ba_(0.3)Sr_(0.7))(Zn_(1/3)Nb_(2/3))O_3 as targetFeifei Ji; Feng Shi; Shuyun Wang; Shuyun Teng; Shouzhen Jiang20122012, vol.23, no.1
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