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期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2009, vol.20, no.1 2009, vol.20, no.10 2009, vol.20, no.11 2009, vol.20, no.12 2009, vol.20, no.2 2009, vol.20, no.3
2009, vol.20, no.4 2009, vol.20, no.5 2009, vol.20, no.6 2009, vol.20, no.7 2009, vol.20, no.8 2009, vol.20, no.9

题名作者出版年年卷期
Review: Microwave ferrites, part 1: fundamental propertiesUmit Ozgur; Yahya Alivov; Hadis Morkoc20092009, vol.20, no.9
Effect of halogen substitution on azo-naphthol dye based poly(alkyloxymethacrylate)s and their Z-scan measurementsP. Delphia Shalini Rosalyn; P. Kannan; G. Vinitha; A. Ramalingam20092009, vol.20, no.9
Function of glycine during solid-state reaction toward well-crystallized fine particulate barium titanateChie Ando; Koichiro Tsuzuku; Tomomi Kobayashi; Hiroshi Kishi; Shinichi Kuroda; Mamoru Senna20092009, vol.20, no.9
Plasma treatment effects on surface morphology and field emission characteristics of carbon nanotubesShih-Fong Lee; Yung-Ping Chang; Li-Ying Lee20092009, vol.20, no.9
Incoherent transport and pseudo-gap in HoBa_2Cu_3O_(7-δ) single crystals with different oxygen contentR. V. Vovk; M. A. Obolenskii; A. A. Zavgorodniy; I. L. Goulatis; A. I. Chroneos; V. M. Pinto Simoes20092009, vol.20, no.9
Formation of interfacial structure of Sn-3.7Ag-0.9Zn eutectic solder with different Al additionsC. Wei; Y. C. Liu; J. B. Wan20092009, vol.20, no.9
Low temperature sintering and microwave dielectric properties of MgNb_2O_6 ceramicsZ. Q. Tian; L. Lin20092009, vol.20, no.9
Dielectric and impedance properties of Nd_(3/2)Bi_(3/2)Fe_5O_(12) ceramicsK. Jawahar; Banarji Behera; R. N. P. Choudhary20092009, vol.20, no.9
Influence of post-deposition annealing on the microstructure and properties of Ga_2O_3:Mn thin films deposited by RF planar magnetron sputteringJoo Han Kim; Kyung Ho Yoon20092009, vol.20, no.9
Adhesion characteristics of Cu/Ni-Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thicknessBo-In Noh; Jeong-Won Yoon; Bo-Young Lee; Seung-Boo Jung20092009, vol.20, no.9
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