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期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2004, vol.15, no.1 2004, vol.15, no.10 2004, vol.15, no.11 2004, vol.15, no.12 2004, vol.15, no.2 2004, vol.15, no.3
2004, vol.15, no.4 2004, vol.15, no.5 2004, vol.15, no.6 2004, vol.15, no.7 2004, vol.15, no.8 2004, vol.15, no.9

题名作者出版年年卷期
Fabrication of epitaxial III-nitride cantilevers on silicon (111) substratesS. DAVIES; T. S. HUANG; R. T. MURRAY; M. H. GASS; A. J. PAPWORTH20042004, vol.15, no.11
Thermal stability of hafnium silicate dielectric films deposited by a dual source liquid injection MOCVDPAUL R. CHALKER; PAUL A. MARSHALL; RICHARD J. POTTER; TIMOTHY B. JOYCE; ANTHONY C. JONES; STEPHEN TAYLOR; TIMOTHY C. Q. NOAKES; P. BAILEY20042004, vol.15, no.11
Progress towards ultrasound applications of new single crystal materialsPABLO MARIN-FRANCH; SANDY COCHRAN; KATHERINE KIRK20042004, vol.15, no.11
Bulk growth of near-IR cadmium mercury telluride (CMT)P. CAPPER; C. MAXEY; C. BUTLER; M. GRIST; J. PRICE20042004, vol.15, no.11
The growth of high quality GaMnAs films by MBEC. T. FOXON; R. P. CAMPION; K. W. EDMONDS; L. ZHAO; K. WANG; N. R. S. FARLEY; C. R. STADDON; B. L. GALLAGHER20042004, vol.15, no.11
Effect of La/Sn co-substitution for Ba/Ta on crystal structure and dielectric properties of Ba{sub}5NdTi{sub}3Ta{sub}7O{sub}30 ceramicsX. H. ZHENG; X. M. CHEN; Y. W. ZENG20042004, vol.15, no.11
Effect of heat-treatment on LaNiO{sub}3 film electrode of PZT thin films derived by a sol-gel methodWEI LU; PING ZHENG; WENJUAN DU; ZHONGYAN MENG20042004, vol.15, no.11
Comparison of electronic structures of doped ZnO by various impurity elements calculated by a first-principle pseudopotential methodYOJI IMAI; AKIO WATANABE20042004, vol.15, no.11
Compositional effects on microstructure evolution and microwave properties of silver-palladium based thick film microstripsSUNIT PANE; VARSHA DESHPANDE; TANAY SETH; GIRISH PHATAK; DINESH AMALNERKAR; ROHINI AVER20042004, vol.15, no.11
Effects of current density and deposition time on electrical resistivity of electroplated Cu layersCHIEN-TAI LIN; KWANG-LUNG LIN20042004, vol.15, no.11



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