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期刊


ISSN1063-7397
刊名Russian Microelectronics
参考译名俄罗斯微电子学
收藏年代2002～2023



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2008, vol.37, no.1 2008, vol.37, no.2 2008, vol.37, no.3 2008, vol.37, no.4 2008, vol.37, no.5 2008, vol.37, no.6

题名作者出版年年卷期
Fully Depleted SOI CMOS Logic Gates for Low-Voltage ApplicationsN. V. Masal'skii20082008, vol.37, no.6
Geometric Aspects of AFM ImagingYu. A. Novikov; A. V. Rakov; P. A. Todua20082008, vol.37, no.6
Numerical Simulation of Two-Particle Resonant Scattering with the Formation of a Molecular IonK. S. Arakelov20082008, vol.37, no.6
High-Frequency Admittance of a Thin Circular Metal WireE. V. Zavitaev; A. A. Yushkanov20082008, vol.37, no.6
Elastic-Stress Relaxation in Heteroepitaxial Structures Investigated by Computer SimulationO. S. Trushin20082008, vol.37, no.6
Formation and Some Properties of Chromium Oxide Nanolayers on SemiconductorsYu. K. Ezhovskii; V. Yu. Kholkin20082008, vol.37, no.6
Initial Stage of Semiinsulating Polycrystalline Silicon Film GrowthA. S. Turtsevich; O. Yu. Nalivaiko; V. A. Solodukha; V. V. Glukhmanchuk; N. G. Tsirkunova; G. V. Lepeshkevich20082008, vol.37, no.6
Sign of Bipolar-Magnetotransistor Sensitivity as Dependent on Device StructureR. D. Tikhonov20082008, vol.37, no.5
Influence of Metallization Impedance on the Current Distribution along the Conducting Tracks from a FET Operated in SaturationV. A. Sergeev20082008, vol.37, no.5
Electrode Geometry as Dependent on Electrolyte Temperature in Thick Cu Film Electrodeposition for Making Tunnel Multilayer StructuresL. B. Jangidze; A. N. Tavkhelidze; Yu. M. Blagidze; R. G. Gulyaev20082008, vol.37, no.5
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