长垣产业园区科技文献服务平台

期刊


ISSN0957-4158
刊名Mechatronics
参考译名机械电子学
收藏年代1998～2023



全部

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2004 2005 2006 2007 2008 2009
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2022 2023

2018, vol.49 2018, vol.50 2018, vol.51 2018, vol.52 2018, vol.53 2018, vol.54
2018, vol.55 2018, vol.56

题名作者出版年年卷期
Reluctance actuator characterization via FEM simulations and experimental testsRamirez-Laboreo, Edgar; Sagues, Carlos20182018, vol.56
A novel biasing mechanism for circular out-of-plane dielectric actuators based on permanent magnetsLoew, P.; Rizzello, G.; Seelecke, S.20182018, vol.56
A MEMS coupled resonator for frequency filtering in airIlyas, Saad; Jaber, Nizar; Younis, Mohammad I.20182018, vol.56
An indirect optimization scheme for tuning a fractional order PI controller using extremum seekingZhao, Jiangbo; Jing, Weican; Wang, Junzheng20182018, vol.56
On-chip capacitive sensing and tilting motion estimation of a micro-stage for in situ MEMS gyroscope calibrationChen, Yi; Aktakka, Ethem Erkan; Woo, Jong-Kwan; Najafi, Khalil; Oldham, Kenn Richard20182018, vol.56
A comparative study of the thermal behavior of three different 3D printer liquefiersJerez-Mesa, R.; Gomez-Gras, G.; Travieso-Rodriguez, J. A.; Garcia-Plana, V.20182018, vol.56
Design and implementation of a real-time hardware-in-the-loop testing platform for a dual-rotor tail-sitter unmanned aerial vehicleSun, Jingxuan; Li, Boyang; Wen, Chih-Yung; Chen, Chih-Keng20182018, vol.56
Sensing and control interface for precise gap controlAndonian, Michael; M'Closkey, Robert T.20182018, vol.56
Application of the principle of energy equivalence to obtain suitable models of parallel planar mechanisms for identification including friction parameters. A case study: 5R RePlaLink haptic mechanismRoldan-Paraponiaris, Constantino; Campa, Francisco J.; Paris, Jascha; Koelling, Thomas; Altuzarra, Oscar; Corves, Burkhard20182018, vol.56
Development of an integrated haptic system for simulating upper gastrointestinal endoscopyChakravarthy, Shanthanu; Rao, Ashwin M.; Thakur, Ravi Kumar; Ananthasuresh, G. K.; Balakuntala, Mythra V. S.20182018, vol.56
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