长垣产业园区科技文献服务平台
主页
文献资源
外文期刊
外文会议
中文期刊
专业机构
起重机械
智能制造
高级检索
关于我们
版权声明
使用帮助
期刊
ISSN
0018-9219
刊名
Proceedings of the IEEE
参考译名
电气与电子工程师学会会报
收藏年代
1998~2013
全部
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2006, vol.94, no.1
2006, vol.94, no.10
2006, vol.94, no.11
2006, vol.94, no.12
2006, vol.94, no.2
2006, vol.94, no.3
2006, vol.94, no.4
2006, vol.94, no.5
2006, vol.94, no.6
2006, vol.94, no.7
2006, vol.94, no.8
2006, vol.94, no.9
题名
作者
出版年
年卷期
Cooling a Microprocessor Chip: Heat spreading, choice of thermal interface materials, and proper heat-sink design can enhance cooling of microprocessor packages and systems
RAVI MAHAJAN; CHIA-PIN CHIU; GREG CHRYSLER
2006
2006, vol.94, no.8
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods: Maximum chip performance under peak permissible temperature limits may be achieved with the help of combined electrical and thermal simulation of VLSI circuits
MASSOUD PEDRAM; SHAHIN NAZARIAN
2006
2006, vol.94, no.8
Temperature-Aware Placement for SOCs: High and uneven temperatures can be avoided when appropriate thermal modeling and simulation are incorporated in placement algorithms for components and interconnections in systems-on-chip
JENG-LIANG TSAI; CHARLIE CHUNG-PING CHEN; GUOQIANG CHEN; BRENT GOPLEN; HAIFENG QIAN; YONG ZHAN; SUNG-MO (STEVE) KANG; MARTIN D. F. WONG; SACHIN S. SAPATNEKAR
2006
2006, vol.94, no.8
Dynamic Surface Temperature Measurements in ICs: High-sensitivity, high-resolution thermal mapping of integrated circuits can be provided by techniques such as scanning with laser beams and embedding of CMOS temperature sensors
JOSEP ALTET; WILFRID CLAEYS; STEFAN DILHAIRE; ANTONIO RUBIO
2006
2006, vol.94, no.8
On-Chip Thermal Management With Microchannel Heat Sinks and Integrated Micropumps: Coolant liquid could be moved through tiny channels on chip surfaces if suitably small and powerful pumps were developed and incorporated into these channels
SURESH V. GARIMELLA; VISHAL SINGHAL; DONG LIU
2006
2006, vol.94, no.8
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components: Boiling, evaporation, jet, and spray cooling, by suitable liquids such as fluorocarbons, might serve to control chip hot-spots and overheating
AVRAM BAR-COHEN; MEHMET ARIK; MICHAEL OHADI
2006
2006, vol.94, no.8
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
RAVI PRASHER
2006
2006, vol.94, no.8
Heat Generation and Transport in Nanometer-Scale Transistors: Heat problems in ever-smaller integrated circuits include hot-spots at transistor drain areas, reduced heat conduction in new devices and higher thermal resistance at material boundaries
ERIC POP; SANJIV SINHA; KENNETH E. GOODSON
2006
2006, vol.94, no.8
Overview of Solid-State Thermoelectric Refrigerators and Possible Applications to On-Chip Thermal Management
JEFF SHARP; JIM BIERSCHENK; HYLAN B. LYON, JR.
2006
2006, vol.94, no.8
Nanoscale Thermal Transport and Microrefrigerators on a Chip: Devices for cooling high power density and dynamic hot spots can be formed by solid-state thin films on the chip, or they could be buried in, bonded to, or mounted on substrates
ALI SHAKOURI
2006
2006, vol.94, no.8
国家科技图书文献中心
全球文献资源网
京ICP备05055788号-26
机械工业信息研究院 2018-2024