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issn1005-0302
刊名材料科学技术学报：英文版
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2022 2023

vol.01 vol.02 vol.03 vol.04 vol.05 vol.06
vol.07 vol.08 vol.09 vol.10 vol.11 vol.12
vol.13 vol.14 vol.15 vol.16 vol.17 vol.18
vol.19 vol.20 vol.21 vol.22 vol.23 vol.24
vol.25 vol.26 vol.27 vol.28 vol.29 vol.30
vol.31 vol.32 vol.33 vol.34 vol.35 vol.36

题名刊名作者出版年年卷期
Switch type PANI/ZnO core-shell microwire heterojunction for UV photodetection材料科学技术:英文版Yihan Chen;Longxing Su;Mingming Jiang;Xiaosheng Fang202210
MATERIALS SCIENCE & TECHNOLOG材料科学技术:英文版 202210
Highly flexible and compressible polyimide/silica aerogels with integrated double network for thermal insulation and fre-retardancy材料科学技术:英文版Jing Tian;Yi Yang;Tiantian Xue;Guojie Chao;Wei Fan;Tianxi Liu202210
Electrical resistivity evolution in electrodeposited Ru and Ru-Co nanowires材料科学技术:英文版Jun Hwan Moon;Seunghyun Kim;Taesoon Kim;Yoo Sang Jeon;Yanghee Kim;Jae-Pyoung Ahn;Young Keun Kim202210
Shear instability in heterogeneous nanolayered Cu/Zr composites材料科学技术:英文版Jianjun Li;Feng Qin;Dingshun Yan;Wenjun Lu;Jiahao Yao202210
Improved electromagnetic dissipation of Fe doping LaCoO_(3)toward broadband microwave absorption材料科学技术:英文版Fan Wang;Weihua Gu;Jiabin Chen;Qianqian Huang;Mingyang Han;Gehuan Wang;Guangbin Ji202210
Revealing the interface structure of{111}typeⅠtwin in Ti-Ni-Hf shape memory alloy composite材料科学技术:英文版Xiaoyang Yi;Bin Sun;Kuishan Sun;Haizhen Wang;Shangzhou Zhang;Zhiyong Gao;Xianglong Meng202210
Unveiling the twinning and dynamic recrystallization behavior and the resultant texture evolution in the extruded Mg-Bi binary alloys during hot compression材料科学技术:英文版Yu-qin Zhang;Wei-li Cheng;Hui Yu;Hong-xia Wang;Xiao-feng Niu;Li-fei Wang;Hang Li202210
Small-scale analysis of brittle-to-ductile transition behavior in pure tungsten材料科学技术:英文版Yeonju Oh;Won-Seok Ko;Nojun Kwak;Jae-il Jang;Takahito Ohmura;Heung Nam Han202210
The synergistic role of Ti microparticles and CeO_(2) nanoparticles in tailoring microstructures and properties of high-quality Ni matrix nanocomposite coating材料科学技术:英文版Lianbo Wang;Shilong Xing;Zizhen Shen;Huabing Liu;Chuanhai Jiang;Vincent Ji;Yuantao Zhao202210
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