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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

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2004 2005 2006 2007 2008 2009
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2018 2019 2020 2021 2022 2023

2011, vol.11, no.1 2011, vol.11, no.10 2011, vol.11, no.11 2011, vol.11, no.2 2011, vol.11, no.3 2011, vol.11, no.4
2011, vol.11, no.5 2011, vol.11, no.6 2011, vol.11, no.7 2011, vol.11, no.8 2011, vol.11, no.9

题名作者出版年年卷期
Scavenging in today's manufacturing operationsHarold Hyman20112011, vol.11, no.8
Reducing defects with embedded sensing technologyTim Skunes; Gerry Padnos20112011, vol.11, no.8
Four ways to reduce voids in BGA/CSP package to substrate connectionsMichael A. Previti; Mitch Holtzer; Tom Hunsinger20112011, vol.11, no.8
Seasonal growth vs. business cycle downturnWalt Custer; Jon Custer-Topai20112011, vol.11, no.8
Training structure the key to successful contentBob Willis20112011, vol.11, no.8
What if...?Joe Fjelstad20112011, vol.11, no.8
Thoughts on outsourcing, Harry Potter, and disinformationJennifer Read20112011, vol.11, no.8



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