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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2008, vol.8, no.1 2008, vol.8, no.10 2008, vol.8, no.11 2008, vol.8, no.12 2008, vol.8, no.2 2008, vol.8, no.3
2008, vol.8, no.4 2008, vol.8, no.5 2008, vol.8, no.6 2008, vol.8, no.7 2008, vol.8, no.8 2008, vol.8, no.9

题名作者出版年年卷期
Case Study: Are two heads really better than one?Trevor Galbraith20082008, vol.8, no.6
Inadequate peak reflow temperatures: A real reliability issue with lead-free soldersWerner Engelmaier20082008, vol.8, no.6
Pushing the barriers of water level device integration High-speed assembly, the case for MicroTapeGordon Christison20082008, vol.8, no.6
First quarter 12% global end market growth slowdown but no disaster on horizonJon Custer; Walt Custer20082008, vol.8, no.6
Manufacturing drives towards regional solutionsTrevor Galbraith20082008, vol.8, no.6
Ball grid array & lead-free assembly defects: Part 2Bob Willis20082008, vol.8, no.6
Process and assembly methods for increased yield of PoP devicesBrian Toleno; Dan Maslyk20082008, vol.8, no.6
Suitable choices for lead-free hand solderingShubo Gao; David M. Jacobson20082008, vol.8, no.6



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