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2000, vol.45, no.1	2000, vol.45, no.10	2000, vol.45, no.11	2000, vol.45, no.2	2000, vol.45, no.3	2000, vol.45, no.4
2000, vol.45, no.5	2000, vol.45, no.6	2000, vol.45, no.7	2000, vol.45, no.8	2000, vol.45, no.9

题名	作者	出版年	年卷期
A new Cu-CMP technology for next generation LSIs	Yoshiaki Oku; Muneyuki Matsumoto; Akira Kamisawa	2000	2000, vol.45, no.10
A study on vibration transfer characteristics of macroscopic liquid meniscus bridge -- frequency dependence of the spring constant and the damping coefficient	Hiroshige Matsuoka; Shigehisa Fukui; Takahisa Kato	2000	2000, vol.45, no.10
CMP and its processing mechanism	Toshiroh Karaki Doy	2000	2000, vol.45, no.10
Current CMP slurries for dielectric layers and their next development	Kouichi Yoshida	2000	2000, vol.45, no.10
Effects of mechanical factors on planarity and uniformity in CMP process	Takeshi Nishioka	2000	2000, vol.45, no.10
Friction and wear characteristics of sintered Fe-Cu powder material	Hiromasa Nadano; Masakazu Nakasako; Masaki Kohno; Harumi Hamanishi; Satoru Nigo	2000	2000, vol.45, no.10
The double bend filtered cathodic arc technology and its tribology applications	Xu Shui	2000	2000, vol.45, no.10
Tribological property and fatigue of carbon fiber reinforced polyphenylene sulfide (PPS) composites under the rolling-sliding condition	Takashi Matsuoka; Kazuhiko Sakaguchi; Yasuhiro Hoshimoto; Hideki Mekada; Tsuneyuki Adachi	2000	2000, vol.45, no.10