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期刊


ISSN1047-4838
刊名JOM
参考译名矿物、金属与材料学会会刊
收藏年代1998～2013



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2009, vol.61, no.1 2009, vol.61, no.10 2009, vol.61, no.11 2009, vol.61, no.12 2009, vol.61, no.2 2009, vol.61, no.3
2009, vol.61, no.4 2009, vol.61, no.5 2009, vol.61, no.6 2009, vol.61, no.7 2009, vol.61, no.8 2009, vol.61, no.9

题名作者出版年年卷期
The EMPMD: A Positive Force in TMS ProgrammingZi-Kui Liu20092009, vol.61, no.6
Atomic Layer Deposition of TiO_2 Thin Films on Nanoporous Alumina Templates: Medical ApplicationsRoger J. Narayan; Nancy A. Monteiro-Riviere; Robin L. Brigmon; Michael J. Pellin; Jeffrey W. Elam20092009, vol.61, no.6
Initial Surface Reactions of Atomic Layer DepositionJiyoung Kim; Tae Wook Kim20092009, vol.61, no.6
The Formation of Well-oriented Dense ZnO Film using MOCVDY. J. Chen; C. H. Ho; H. Y. Lai; J. H. Du20092009, vol.61, no.6
Lead-free Soldering: Materials Science and Solder Joint ReliabilityKejun Zeng20092009, vol.61, no.6
Microstructural Coarsening in Sn-Ag-based Solders and Its Effects on Mechanical PropertiesI. Dutta; P. Kumar; G. Subbarayan20092009, vol.61, no.6
Lead-free Solders with Rare Earth AdditionsFu Guo; Mengke Zhao; Zhidong Xia; Yongping Lei; Xiaoyan Li; Yaowu Shi20092009, vol.61, no.6
Cracking and Phase Stability in Reaction Layers between Sn-Cu-Ni Solders and Cu SubstratesK. Nogita; C. M. Gourlay; T. Nishimura20092009, vol.61, no.6
Surface Oxidation of Molten Sn(Ag, Ni, In, Cu) AlloysY. Y. Lee; H. W. Tseng; Y. H. Hsiao; C. Y. Liu20092009, vol.61, no.6
A Corrosion Investigation of Solder Candidates for High-temperature ApplicationsVivek Chidambaram; John Hald; Rajan Ambat; Jesper Hattel20092009, vol.61, no.6
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