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期刊

ISSN	1047-4838
刊名	JOM
参考译名	矿物、金属与材料学会会刊
收藏年代	1998～2013

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2002, vol.54, no.1	2002, vol.54, no.10	2002, vol.54, no.11	2002, vol.54, no.12	2002, vol.54, no.2	2002, vol.54, no.3
2002, vol.54, no.4	2002, vol.54, no.5	2002, vol.54, no.6	2002, vol.54, no.7	2002, vol.54, no.8	2002, vol.54, no.9

题名

作者

出版年

年卷期

The symposium imaging of dynamic processes: multimedia highlights

Iver E. Anderson

2002

2002, vol.54, no.6

Developments in lead-free solders and soldering technology

Sung K. Kang

2002

2002, vol.54, no.6

Sn-Ag-Cu solders and solder joints: alloy development, microstructure, and properties

I. E. Anderson; B. A. Cook; J. L. Harringa; R. L. Terpstra

2002

2002, vol.54, no.6

The creep properties of lead-free solder joints

H. G. Song; J. W. Morris, Jr.; F. Hua

2002

2002, vol.54, no.6

Electromigration in solder joints and solder lines

H. Gan; W. J. Choi; G. Xu; K. N. Tu

2002

2002, vol.54, no.6

Aspects of the structural evolution of lead-free solder joints

A. Zribi; R. Kinyanjui; P. Borgesen; L. Zavalij; E. J. Cotts

2002

2002, vol.54, no.6

Experiments for first year engineering students using Tin-bismuth alloys

Mark A. Palmer; Kurt Wainwright; Lung C. Fok; Benjamin Jones

2002

2002, vol.54, no.6

Using mechanical processing in recycling printed wiring boards

Hugo M. Veit; Carolina de C. Pereira; Andrea M. Bernardes

2002

2002, vol.54, no.6

The electrochemical recycling of printed-wiring-board etchants

P. Adaikkalam; G. N. Srinivasan; K. V. Venkateswaran

2002

2002, vol.54, no.6

Recovering copper using a combination of electrolytic cells

Shijie Wang

2002

2002, vol.54, no.6