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期刊
ISSN
0018-9219
刊名
Proceedings of the IEEE
参考译名
电气与电子工程师学会会报
收藏年代
1998~2013
全部
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2009, vol.97, no.1
2009, vol.97, no.10
2009, vol.97, no.11
2009, vol.97, no.12
2009, vol.97, no.2
2009, vol.97, no.3
2009, vol.97, no.4
2009, vol.97, no.5
2009, vol.97, no.6
2009, vol.97, no.7
2009, vol.97, no.8
2009, vol.97, no.9
题名
作者
出版年
年卷期
SoC and SiP, the Yin and Yang of the Tao for the New Electronic Era
ALFONSO MAURELLI; DIDIER BELOT; GIOVANNI CAMPARDO
2009
2009, vol.97, no.1
3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems
JIAN-QIANG LU
2009
2009, vol.97, no.1
3-D Stacked Package Technology and Trends
FLYNN P. CARSON; YOUNG CHEOL KIM; IN SANG YOON
2009
2009, vol.97, no.1
Through-Silicon Via (TSV)
MAKOTO MOTOYOSHI
2009
2009, vol.97, no.1
High-Density Through Silicon Vias for 3-D LSIs
MITSUMASA KOYANAGI; TAKAFUMI FUKUSHIMA; TETSU TANAKA
2009
2009, vol.97, no.1
System on Wafer: A New Silicon Concept in SiP
GILLES POUPON; NICOLAS SILLON; DAVID HENRY; CHARLOTTE GILLOT; ALAN MATHEWSON; LEA DI CIOCCIO; BARBARA CHARLET; PATRICK LEDUC; MAUD VINET; PERRINE BATUDE
2009
2009, vol.97, no.1
A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages
LUIGI PIETRO MARIA COLOMBO; DAVIDE PALEARI; ALEXEY PETRUSHIN
2009
2009, vol.97, no.1
A Neural Network-Based Prediction Model in Embedded Processes of Gold Wire Bonding Structure for Stacked Die Package
CHIN-HUANG CHANG; YUNG-HSIANG HUNG
2009
2009, vol.97, no.1
Signal Integrity Flow for System-in-Package and Package-on-Package Devices
PAOLO PULICI; GIAN PIETRO VANALLI; MICHELE A. DELLUTRI; DOMENICO GUARNACCIA; FILIPPO LO IACONO; GIOVANNI CAMPARDO; GIANCARLO RIPAMONTI
2009
2009, vol.97, no.1
3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot
PAUL MARCHAL; BRUNO BOUGARD; GURUPRASAD KATTI; MICHELE STUCCH; WIM DEHAENE; ANTONIS PAPANIKOLAOU; DIEDERIK VERKEST; BART SWINNEN; ERIC BEYNE
2009
2009, vol.97, no.1
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