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期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2023

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


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2022 2023

2006, vol.12, no.10-11 2006, vol.12, no.12 2006, vol.12, no.3 2006, vol.12, no.4 2006, vol.12, no.5 2006, vol.12, no.6
2006, vol.12, no.7 2006, vol.12, no.8 2006, vol.12, no.9

题名作者出版年年卷期
Surface plasma treatments enabling low temperature direct bondingHubert Moriceau; Francois Rieutord; Christophe Morales; Anne Marie Charvet20062006, vol.12, no.5
Effect of interfacial SiO{sub}2 thickness for low temperature O{sub}2 plasma activated wafer bondingBenoit Olbrechts; Xuanxiong Zhang; Yannick Bertholet; Thomas Pardoen; Jean-Pierre Raskin20062006, vol.12, no.5
Direct bonding with on-wafer metal interconnectionsC. Jia; M. Wiemer; T. Gessner20062006, vol.12, no.5
Wafer direct bonding with ambient pressure plasma activationMarkus Gabriel; Brad Johnson; Ralf Suss; Manfred Reiche; Marko Eichler20062006, vol.12, no.5
Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)H. Luoto; T. Suni; M. Kulawski; K. Henttinen; H. Kattelus20062006, vol.12, no.5
Bonded thick film SOI with pre-etched cavitiesTommi Suni; Kimmo Henttinen; James Dekker; Hannu Luoto; Martin Kulawski; Jari Makinen; Risto Mutikainen20062006, vol.12, no.5
Discussion of tooling solutions for the direct bonding of silicon wafersNick Aitken; Tony Rogers20062006, vol.12, no.5
Versatile low temperature wafer bonding and bond strength measurement by a blister test methodAlexander Doll; Martin Rabold; Frank Goldschmidtboing; Peter Woias20062006, vol.12, no.5
Influence of the frequency on fatigue of directly wafer-bonded siliconJorg Bagdahn; Michael Bernasch; Matthias Petzold20062006, vol.12, no.5
Fabrication of microfluidic networks with integrated electrodesD. C. Hermes; T. Heuser; E. J. van der Wouden; J. G. E. Gardeniers; A. van den Berg20062006, vol.12, no.5
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