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期刊


ISSN1550-4832
刊名ACM Journal on Emerging Technologies in Computing Systems
参考译名ACM计算系统新兴技术杂志
收藏年代2008~2025



全部

2008 2009 2010 2011 2012 2013
2014 2015 2016 2017 2018 2019
2020 2021 2022 2023 2024 2025

2022, vol.18, no.1 2022, vol.18, no.2 2022, vol.18, no.3 2022, vol.18, no.4

题名作者出版年年卷期
Enhancing Privacy in PUF-Cash through Multiple Trusted Third Parties and Reinforcement LearningGEORGIOS FRAGKOS; CYRUS MINWALLA; EIRINI ELENI TSIROPOULOU; JIM PLUS QUELLIC20222022, vol.18, no.1
Fortifying Vehicular Security through Low Overhead Physically Unclonable FunctionsCARSON LABRADO; HIMANSHU THAPLIYAL; SARAJU P. MOHANTY20222022, vol.18, no.1
A Modular End-to-End Framework for Secure Firmware Updates on Embedded SystemsSOLON FALAS; CHARALAMBOS KONSTANTINOU; MARIA K. MICHAEL20222022, vol.18, no.1
Integrated Power Signature Generation Circuit for IoT Abnormality DetectionDAVID THOMPSON; HAIBO WANG20222022, vol.18, no.1
SCALPEL: Exploring the Limits of Tag-enforced CompartmentalizationNICK ROESSLER; ANDRE DEHON20222022, vol.18, no.1
Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICsARJUN CHAUDHURI; SANMITRA BANERJEE; JINWOO KIM; HEECHUN PARK; BON WOONG KU; SUKESHWAR KANNAN; KRISHNENDU CHAKRABARTY; SUNG KYU LIM20222022, vol.18, no.1
EM-X-DL: Efficient Cross-device Deep Learning Side-channel Attack With Noisy EM SignaturesJOSEF DANIAL; DEBAYAN DAS; ANUPAM GOLDER; SANTOSH GHOSH; ARIJIT RAYCHOWDHURY; SHREYAS SEN20222022, vol.18, no.1
A ReRAM Memory Compiler for Monolithic 3D Integrated Circuits in a Carbon Nanotube ProcessEDWARD LEE; DAEHYUN KIM; JINWOO KIM; SUNG KYU LIM; SAIBAL MUKHOPADHYAY20222022, vol.18, no.1
PUF based Secure and Lightweight Authentication and Key-Sharing Scheme for Wireless Sensor NetworkMAHABUB HASAN MAHALAT; DIPANKAR KARMAKAR; ANINDAN MONDAL; BIBHASH SEN20222022, vol.18, no.1
Low-overhead Hardware Supervision for Securing an IoT Bluetooth-enabled Device: Monitoring Radio Frequency and Supply VoltageABDELRAHMAN ELKANISHY; PAUL M. FURTH; DERRICK T. RIVERA; ABDEL-HAMEED A. BADAWY20222022, vol.18, no.1
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