长垣产业园区科技文献服务平台

期刊


刊名Flexible and Printed Electronics
参考译名柔性和印刷电子学
收藏年代2019～2024



全部

2019 2020 2021 2022 2023 2024

2021, vol.6, no.1 2021, vol.6, no.2 2021, vol.6, no.3 2021, vol.6, no.4

题名作者出版年年卷期
ROADMAP: The 2021 flexible and printed electronics roadmapYvan Bonnassieux; Christoph J Brabec; Yong Cao; Tricia Breen Carmichael; Michael L Chabinyc; Kwang-Ting Cheng; Gyoujin Cho; Anjung Chung; Corie L Cobb; Andreas Distler; Hans-Joachim Egelhaaf; Gerd Grau; Xiaojun Guo; Ghazaleh Haghiashtiani; Tsung-Ching Huang; Muhammad M Hussain; Benjamin Iniguez; Taik-Min Lee; Ling Li; Yuguang Ma; Dongge Ma; Michael C McAlpine; Tse Nga Ng; Ronald Osterbacka; Shrayesh N Patel; Junbiao Peng; Huisheng Peng; Jonathan Rivnay; Leilai Shao; Daniel Steingart; Robert A Street; Vivek Subramanian; Luisa Torsi; Yunyun Wu20212021, vol.6, no.2
Hybrid fabrication of LED matrix display on multilayer flexible printed circuit boardThanh Huy Phung; Jaehyeong Jeong; Anton Nailevich Gafurov; Inyoung Kim; Sung Yong Kim; Hak-Jun Chung; Yoonkap Kim; Han-Jung Kim; Kyoung Min Kim; Taik-Min Lee20212021, vol.6, no.2
Highly stable and printable Ag NWs/GO/PVP composite ink for flexible electronicsShang Wang; Yan Feng; He Zhang; Qiqi Peng; Yanhong Tian20212021, vol.6, no.2
Registration error analysis and compensation of roll-to-roll screen printing system for flexible electronicsAnton Nailevich Gafurov; Jaehyeong Jeong; Pyoungwon Park; Inyoung Kim; Thanh Huy Phung; Hyun-Chang Kim; Dongwoo Kang; Dongho Oh; Taik-Min Lee20212021, vol.6, no.2
Enhancing performance and reducing wearing variability for wearable technology system-body interfaces using shape memory materialsRachael Granberry; Crystal Compton; Heidi Woelfle; Justin Barry; Brad Holschuh20212021, vol.6, no.2
A simple process to create micro-gaps in printed copper electrodes by sintering induced stress in flexible PET substratesXinzhou Wu; Wei Yuan; Wenming Su; Zheng Cui; Simeng Zhu; Ming Deng20212021, vol.6, no.2
A triple layer printed blue OLED with blurred interfaceFan Yu; Yan Wang; Rongrong Xia; Yihua Jian; Lei Liu; Tao Chu; Zixing Wang; Zugang Liu; DongYu Zhang; Zheng Cui20212021, vol.6, no.2
Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronicsKartik Sondhi; Sai Guruva Reddy Avuthu; Jorg Richstein; Z Hugh Fan; Toshikazu Nishida20212021, vol.6, no.2
Fabrication of RF elements on thin plastic substrate using laser engraving techniqueNickolas Littman; G O'Keefe Steven; Amir Galehdar; Hugo G Espinosa; David V Thiel20212021, vol.6, no.2
Measurement and analysis on failure lifetime of serpentine interconnects for e-textiles under cyclic large deformationTomoya Koshi; Ken-ichi Nomura; Manabu Yoshida20212021, vol.6, no.2
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