长垣产业园区科技文献服务平台

期刊


ISSN0914-4935
刊名Sensors and materials
参考译名传感器与材料
收藏年代1998～2023



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2022 2023

2018, vol.30, no.1 2018, vol.30, no.10 Pt.1 2018, vol.30, no.12 Pt.1 2018, vol.30, no.12 Pt.2 2018, vol.30, no.12 Pt.3 2018, vol.30, no.2
2018, vol.30, no.3 2018, vol.30, no.3 Pt.2 2018, vol.30, no.4 Pt.1 2018, vol.30, no.4 Pt.2 2018, vol.30, no.5 Pt.1 2018, vol.30, no.5 Pt.2
2018, vol.30, no.6 Pt.1 2018, vol.30, no.6 Pt.2 2018, vol.30, no.7 Pt.1 2018, vol.30, no.7 Pt.2 2018, vol.30, no.8 Pt.1 2018, vol.30, no.8 Pt.2
2018, vol.30, no.9 Pt.1 2018, vol.30, no.9 Pt.2

题名作者出版年年卷期
In situ Monitoring of Vapor-phase Polymerization and Characterization of Poly(3,4-ethylenedioxythiophene) Thin FilmsKoshiba, Yasuko; Hirai, Mana; Horike, Shohei; Morimoto, Masahiro; Misaki, Masahiro; Fukushima, A. Tastuya; Ishida, Kenji20182018, vol.30, no.12 Pt.2
Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3Tomimatsu, Tort; Takigawa, Ryo20182018, vol.30, no.12 Pt.2
Stress-enhanced Cu-to-Cu Bonding for MEMS PackagingSong, Jenn-Ming; Lang, Sin-Yong; Xie, Zong-Yu; Chiang, Po-Hao; Huang, Shang-Kun; Chiu, Ying-Ta; Tarng, David; Hung, Chih-Pin; Lin, Jing-Yuan20182018, vol.30, no.12 Pt.2
Room-temperature Hermetic Packaging Using Ultrasonic Cu-Cu Bonding with Compliant RimTakigawa, Ryo; Iwanabe, Keiichiro; Ikeda, Akihiro; Takao, Takayuki; Asano, Tanemasa20182018, vol.30, no.12 Pt.2
Fine Cone-shaped Bumps for Three-dimensional LSI Package-An Optimization of Thermocompression Bonding ProcessNemoto, Shunsuke; Lim, Ying Ying; Nakagawa, Hiroshi; Kikuchi, Katsuya; Aoyagi, Masahiro20182018, vol.30, no.12 Pt.2
Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS AccelerometerTakayasu, Motohiro; Tsuji, Ippei; Ito, Hiroyuki; Yamane, Daisuke; Dosho, Shiro; Konishi, Toshifumi; Ishihara, Noboru; Machida, Katsuyuki; Masu, Kazuya20182018, vol.30, no.12 Pt.2
Exploring Land Cover Classification Accuracy of Landsat 8 Image Using Spectral Index Layer Stacking in Hilly Region of South KoreaLee, Jae Kang; Acharya, Tri Dev; Lee, Dong Ha20182018, vol.30, no.12 Pt.2
Antenna Sensor for Radio-wave-type EndoscopeFujimoto, Takafumi; Kawashima, Keiya; Horiguchi, Genki; Tanaka, Toshiyuki20182018, vol.30, no.12 Pt.2
Wake-up Radio-resilient Scanning Mechanism for Mobile Device in IEEE 802.11baPark, Hyunhee; Kim, Eui-Jik20182018, vol.30, no.12 Pt.2
Impedance-matched Planar-antenna-integrated High-efficiency Push-pull Power Amplifier with Center-tapped Transformer for 5 GHz Wireless CommunicationKuboki, Takeshi; Sadakiyo, Tomoki; Park, Wee Sang; Kanaya, Haruichi20182018, vol.30, no.12 Pt.2



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