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期刊


ISSN1359-4311
刊名Applied Thermal Engineering
参考译名实用热力工程
收藏年代2002～2023



全部

2002 2003 2004 2005 2006 2007
2008 2009 2010 2011 2012 2013
2014 2015 2016 2017 2018 2019
2020 2021 2022 2023

2012, vol.32 2012, vol.33/34 2012, vol.35 2012, vol.36 2012, vol.37 2012, vol.38
2012, vol.39 2012, vol.40 2012, vol.41 2012, vol.42 2012, vol.43 2012, vol.44
2012, vol.45/46 2012, vol.47 2012, vol.48 2012, vol.49

题名作者出版年年卷期
Thermal performance of a heat pipe with nanoparticles coated wickA. Brusly Solomon; K. Ramachandran; B. C. Pillai20122012, vol.36
Computer simulations of natural convection of single phase nanofluids in simple enclosures: A critical reviewOmid Abouali; Goodarz Ahmadi20122012, vol.36
Exergoeconomic optimization of a trigeneration system for heating, cooling and power production purpose based on TRR method and using evolutionary algorithmH. Ghaebi; M. H. Saidi; P. Ahmadi20122012, vol.36
Design for thermal sensation and comfort states in vehicles cabinsAli Alahmer; Mahmoud Abdelhamid; Mohammed Omar20122012, vol.36
Feasibility study of microalgal and jatropha biodiesel production plants: Exergy analysis approachCynthia Ofori-Boateng; Teong Lee Keat; Lim JitKang20122012, vol.36
The tuning methodology of a GE 7FA + e DLN-2.6 gas turbine combustorJeongseog Oh; Minki Kim; Youngbin Yoon20122012, vol.36
Performance of microchannel condensers with metal foams on the air-side: Application in small-scale refrigeration systemsG. B. Ribeiro; J. R. Barbosa, Jr.; A. T. Prata20122012, vol.36
Single phase cooling of large surfaces with square arrays of impinging water spraysRicardo Hernandez Pereira; Sergio Leal Braga; Jose Alberto Reis Parise20122012, vol.36
Power generation from waste heat in a food processing applicationMathew Aneke; Brian Agnew; Chris Underwood; Hongwei Wu; Salah Masheiti20122012, vol.36
Thermal conduction analysis and characterization of solder bumps in flip chip packageXiangning Lu; Tielin Shi; Qi Xia; Guanglan Liao20122012, vol.36
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