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期刊
ISSN
1345-9678
刊名
Materials Transactions
参考译名
材料汇刊
收藏年代
2003~2024
关联期刊
参考译名
收藏年代
Materials Transactions, JIM
日本金属学会材料汇刊
1998~2003
全部
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2024
2005, vol.46, no.1
2005, vol.46, no.10
2005, vol.46, no.11
2005, vol.46, no.12
2005, vol.46, no.2
2005, vol.46, no.3
2005, vol.46, no.4
2005, vol.46, no.5
2005, vol.46, no.6
2005, vol.46, no.7
2005, vol.46, no.8
2005, vol.46, no.9
题名
作者
出版年
年卷期
Mechanism and Prevention of Spontaneous Tin Whisker Growth
King-Ning Tu; Jong-ook Suh; Albert Tzu-Chia Wu; Nobumichi Tamura; Chih-Hang Tung
2005
2005, vol.46, no.11
Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evaluated by Micro Size Specimen
Yoshiharu Kariya; Tomokazu Niimi; Tadatomo Suga; Masahisa Otsuka
2005
2005, vol.46, no.11
Fatigue Reliability Evaluation for Sn-Zn-Bi and Sn-Zn Lead-Free Solder Joints
Qiang Yu; Jae-Chul Jin; Do-Seop Kim; Masaki Shiratori
2005
2005, vol.46, no.11
Reliability of Sn-8 mass%Zn-3 mass%Bi Lead-Free Solder and Zn Behavior
Sun-Yun Cho; Young-Woo Lee; Kyoo-Seok Kim; Young-Jun Moon; Ji-Won Lee; Hyun-Joo Han; Mi-Jin Kim; Jae-Pil Jung
2005
2005, vol.46, no.11
Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
Ikuo Shohji; Kiyokazu Yasuda; Tadashi Takemoto
2005
2005, vol.46, no.11
Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders
Takehiko Takahashi; Susumu Hioki; Ikuo Shohji; Osamu Kamiya
2005
2005, vol.46, no.11
Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders
Joo Won Lee; Zin Hyoung Lee; Hyuck Mo Lee
2005
2005, vol.46, no.11
IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
Shinji Ishikawa; Eiji Hashino; Taro Kono; Kohei Tatsumi
2005
2005, vol.46, no.11
Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil Printing
Jaesik Lee; Jae-Pil Jung; Chu-Seon Cheon; Yunhong Zhou; Michael Mayer
2005
2005, vol.46, no.11
Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Dae-Gon Kim; Seung-Boo Jung
2005
2005, vol.46, no.11
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