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ISSN0915-1869
刊名表面技術
参考译名表面技术
收藏年代1998～2025



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2003, vol.54, no.1 2003, vol.54, no.10 2003, vol.54, no.11 2003, vol.54, no.12 2003, vol.54, no.5 2003, vol.54, no.9

题名作者出版年年卷期
Processing of Transparent Super-Hydrophobic Polymer Film by Screen Printing MethodKoji TAKEDA; Tsutomu KURAMOCHI; Tomoaki NOZAWA; Nobuo KIEDA; Keiichi KATAYAMA; Akira NAKAJIMA20032003, vol.54, no.10
Improvements of Via-Filling in Neutral Electroless Copper Plating for ULSI MetallizationHidemi NAWAFUNE; Shingo HIGUCHI; Kensuke AKAMATSU; Ei UCHIDA20032003, vol.54, no.10
Synthesis of Diamond on Iron Substrate by Hot-Filament CVDYutaka ISHIKAWA; Yutaka SASAKI20032003, vol.54, no.10
Pulse Electrochemical Etching of NiTi Shape Memory Alloy in LiCl-Ethanol ElectrolyteTakashi MINETA20032003, vol.54, no.10
Growth Manner of Silica Film on Polyethylene Terephthalate Substrates in Plasma-Enhanced Chemical Vapor DepositionKatsuya TESHIMA; Yasushi INOUE; Hiroyuki SUGIMURA; Osamu TAKAI20032003, vol.54, no.10
The Surface Modification of Lead Using Electrochemical Potential Sweep TechniqueAkihiko HIROTA; Yoshiaki ARAI; Shigeo SATO; Seiji KAMASAKI20032003, vol.54, no.10
Effects of Various Additives on the Characteristics of Electroplated Nickel Thin FilmsKeisuke KISHIMOTO; Shinji YOSHIOKA; Koichi KOBAYAKAWA; Yuichi SATO20032003, vol.54, no.10
The Decline of the Friction Coefficient of Electroless Plated Composite Films by the Addition of Hydrophilic Carbon Black Particles to the BathYukie MISHIBA; Yuma SAKAI; Sachio YOSHIHARA; Takashi SHIRAKASHI; Akira KUWANA20032003, vol.54, no.10
Copper Plating Using Gel Electrolyte III. Electrodeposition of Copper from Thin Film of Gel ElectrolyteMasayuki ITAGAKI; Ken-ichi SHIMODA; Kunihiro WATANABE; Kazuya YASUDA20032003, vol.54, no.10



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