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期刊


ISSN0915-1869
刊名表面技術
参考译名表面技术
收藏年代1998～2025



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2002, vol.53, no.1 2002, vol.53, no.10 2002, vol.53, no.12 2002, vol.53, no.2 2002, vol.53, no.3 2002, vol.53, no.4
2002, vol.53, no.5 2002, vol.53, no.6 2002, vol.53, no.7 2002, vol.53, no.8 2002, vol.54, no.2

题名作者出版年年卷期
Reliability of joint interfaces in electronics packaging technologyKojiro F. Kobayashi20022002, vol.54, no.2
Formation of UBM for the high quality bonding on aluminum alloy electrode using electroless platingSatoshi Kawashima20022002, vol.54, no.2
Micro-connection for IC Bonding using electroless platingYuji Nishitani; Hisashi Hayakawa; Ken Orui; Hiroko Jinno; Hiroshi Asami20022002, vol.54, no.2
Joint reliability and plating technology in semiconductor packagingYutaka Tsukada20022002, vol.54, no.2
Plating technologies for joints used in tape carriers for semiconductor packagesAkira Chinda20022002, vol.54, no.2
Reliability and interfacial structures of solder joint between lead free solder and electroless plated Ni-P alloy filmYasunori Chonan; Takao Komiyama; Jin Onuki20022002, vol.54, no.2
Sol-Gel coating on magnesium alloy and its evaluation of corrosion resistanceHitonori Sato; Shinji Hirai; Kazuyoshi Shimakage; Kenji Wada20022002, vol.54, no.2
Fabrication of micro-printed circuit board by aluminum anodizing and laser irradiation - influence of thickness of oxide film on formation of patternTatsuya Kikuchi; Masatoshi Sakairi; Hideaki Takahashi; Yoshihiko Abe; Naoki Katayama20022002, vol.54, no.2
New electrolyte solutions for electrochemical etching of NiTi shape memory alloyTakashi Mineta20022002, vol.54, no.2
Adsorbates formed on non-conducting substrates by two-step catalyzation pretreatment for electroless platingKenji Yamagishi; Shinji Yae; Naoki Okamoto; Naoki Fukumuro; Hitoshi Matsuda20022002, vol.54, no.2
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