长垣产业园区科技文献服务平台 | cy.gmachineinfo.com

期刊

全部

2002, vol.53, no.1	2002, vol.53, no.10	2002, vol.53, no.12	2002, vol.53, no.2	2002, vol.53, no.3	2002, vol.53, no.4
2002, vol.53, no.5	2002, vol.53, no.6	2002, vol.53, no.7	2002, vol.53, no.8	2002, vol.54, no.2

题名	作者	出版年	年卷期
Super-connect technology	Takayasu Sakurai	2002	2002, vol.53, no.4
Wafer level three dimensional integration technology	Hiroyuki Kurino; Mitsumasa Koyanagi	2002	2002, vol.53, no.4
"10μm-rule" patterning technology using copper electroplating	Takeshi Wakabayashi	2002	2002, vol.53, no.4
Barrel plating operation (1) - primary current distribution in barrel plating	Yoshiaki Hoshino	2002	2002, vol.53, no.4
Applications of insoluble anode to electroplating and the advantages -part 1: the fundamental aspects of insoluble anode	Fujio Matsui; Yo-ichiro Suzuki	2002	2002, vol.53, no.4
Monte Carlo simulation in thin film growth with defect formation - application to via filling	Yutaka Kaneko; Yasuaki Hiwatari; Katsuhiko Ohara; Toru Murakami	2002	2002, vol.53, no.4
Initial deposition behavior of electroless nickel on glass substrate	Seiji Yamamoto; Katsuhiko Tashiro; Hideo Honma	2002	2002, vol.53, no.4
The influence of oxidation of Cr surface on formation of the deposited films of 6-dibutylamino-1,3,5-triazine-2,4-dithiol	Kazunori Suzuki; Kunio Mori; Hidetoshi Hirahara; Kenji Shimizu	2002	2002, vol.53, no.4
Superelasticity of sputter-deposited Ti-Ni thin films	Morio Sato; Akira Ishida	2002	2002, vol.53, no.4
Conditions of the oligomer formation of VTES and VTMS suitable for the donation of effective hydrophobicity to TiO{sub}2	Sumiko Sanuki; Yoshihiko Nishi; Toshihiro Yoshimoto; Hiroshi Majima	2002	2002, vol.53, no.4