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2001, vol.52, no.1	2001, vol.52, no.10	2001, vol.52, no.11	2001, vol.52, no.12	2001, vol.52, no.2	2001, vol.52, no.3
2001, vol.52, no.4	2001, vol.52, no.5	2001, vol.52, no.6	2001, vol.52, no.7	2001, vol.52, no.8	2001, vol.52, no.9

题名	作者	出版年	年卷期
3D chip stacking technology and surface finishing	Kenji Takahashi	2001	2001, vol.52, no.7
Through electrode in Si wafer	Masataka Hoshino	2001	2001, vol.52, no.7
Bonding technology of solid state based on gas-phase fluorination	Katsuhiro Takahashi	2001	2001, vol.52, no.7
3-Dimensional opto-electronic packaging technology	Hideyuki Takahara	2001	2001, vol.52, no.7
Application of fine pattern plating technology for 3-Dimensional assembly technologies	Shin-ichi Wakabayashi; Michio Horiuchi; Takashi Kurihara	2001	2001, vol.52, no.7
Techniques for analyzing and measuring adhesion strength between thin films for 3-dimensional electronic packaging	Tomio Iwasaki	2001	2001, vol.52, no.7
Application of STEM method in scanning electron microscope	Hiroshi Fujitani	2001	2001, vol.52, no.7
Boriding of high silicon stainless steel by fluidized bed method	Nobuhiro Ueda; Takumi Sone; Kei Kemizu; Tomoyuki Mizukoshi; Akira Ikenaga; Makoto Kawamoto	2001	2001, vol.52, no.7
A study on the measurement of Young's modulus of hot-dip Zn coated steel by laser speckle interferometry	Yoshiro Tani; Yoshihiko Hagiwara; Shinichi Ohya; Kazushige Chiba	2001	2001, vol.52, no.7
Effect of contact cooling length between the laminating rolls on the biaxial orientation changes of polyester film in the laminating process	Shun-ichi Morita; Hiroyuki Iwashita; Atsuo Tanaka; Norimasa Maida	2001	2001, vol.52, no.7