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期刊


ISSN0915-1869
刊名表面技術
参考译名表面技术
收藏年代1998～2025



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2001, vol.52, no.1 2001, vol.52, no.10 2001, vol.52, no.11 2001, vol.52, no.12 2001, vol.52, no.2 2001, vol.52, no.3
2001, vol.52, no.4 2001, vol.52, no.5 2001, vol.52, no.6 2001, vol.52, no.7 2001, vol.52, no.8 2001, vol.52, no.9

题名作者出版年年卷期
Electronics packaging using plating technologyShuhei Miura; Hideo Honma20012001, vol.52, no.5
Present situation of the plating technology for lead-free solderingSusumu Arai; Norio Kaneko; Naoyuki Shinohara20012001, vol.52, no.5
Metal finishing technology for the assembly of BGA and CSPKunihiko Nishi20012001, vol.52, no.5
Electroless nickel/immersion gold to enhance the reliability of the solder joint strengthYasuhiro Watanabe20012001, vol.52, no.5
Metal/polymer interface control technology in electronic packaging systemYasuo Nakatsuka20012001, vol.52, no.5
FPC connection technology using alkaneToshihiro Miyake20012001, vol.52, no.5
Process of structure gradient by spark plasma sintering (SPS)Mamoru Omori; Toshio Hirai20012001, vol.52, no.5
Design of bioactive functionally graded materialsTadashi Kokubo; Hyun-Min Kim20012001, vol.52, no.5
Electrical property of functionally graded perovskiteHideki Taguchi20012001, vol.52, no.5
Development of a non-cyanide electroless gold plating bathTakashi Inoue20012001, vol.52, no.5
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