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ISSN
0915-1869
刊名
表面技術
参考译名
表面技术
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1998, vol.49, no.1
1998, vol.49, no.11
1998, vol.49, no.12
1998, vol.49, no.2
1998, vol.49, no.3
1998, vol.49, no.4
1998, vol.49, no.5
1998, vol.49, no.6
1998, vol.49, no.7
1998, vol.49, no.8
1998, vol.49, no.9
1998. vol.49, no.10
题名
作者
出版年
年卷期
Autocatalytic electroless gold plating bath using gold sulfite salt
Somei Yarita
1998
1998, vol.49, no.3
Charge compensation on the SEM observation of catalyst, using specimen heating
Koichi Yoshida
1998
1998, vol.49, no.3
Coated electrocatalyst layer for oxygen evolution with gradient silica concentration: iridium oxide-colloidal silica/titanium substrate system
Kastuhiko Mushiake; Kikuo Matsusaka
1998
1998, vol.49, no.3
Cobalt and nickel effects on electrodeposited iron-tungsten-based alloy film amorphization
Ming Li; Masatsugu Morimitsu; Morio Matsunaga
1998
1998, vol.49, no.3
Corrosion and corrosion prevention on plating equipment-A field study
Taichi Nakamura; Fujio Matsui; Ikuo Nakayama
1998
1998, vol.49, no.3
Decorative trivalent chromium
Daiki Matsuura
1998
1998, vol.49, no.3
Development of Pb free solder plating
Hidekatsu Koyano
1998
1998, vol.49, no.3
Dissolution behavior of silver anode in cyanide free bath
Seishi Masaki; Tetsuya Kondo; Hiroyuki Inoue; Hideo Honma
1998
1998, vol.49, no.3
Drying technology for silicon wafer in semiconductor manufacturing
Cozy Ban; Kazunao Sato
1998
1998, vol.49, no.3
Effect of water absorption of dielectric underlayers on texture and reliability in Al-Si-Cu/Ti/TiN/Ti layered interconnects
Tomoyuki Yoshida; Takeshi Ohwaki
1998
1998, vol.49, no.3
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