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期刊


ISSN0915-1869
刊名表面技術
参考译名表面技术
收藏年代1998～2025



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1998, vol.49, no.1 1998, vol.49, no.11 1998, vol.49, no.12 1998, vol.49, no.2 1998, vol.49, no.3 1998, vol.49, no.4
1998, vol.49, no.5 1998, vol.49, no.6 1998, vol.49, no.7 1998, vol.49, no.8 1998, vol.49, no.9 1998. vol.49, no.10

题名作者出版年年卷期
A very stable non-cyanide electroless gold plating bath using thiourea and hydroquinone as a cooperating double reductant systemTakashi Inoue; Setsuo Ando; Jiro Ushio; Hiroaki Okudaira; Hiroko Takehara; Toshihiko Ota; Hiroshi Yamamoto; Hitoshi Yoko19981998, vol.49, no.12
Adhesion improvement between conductor and insulation layer with electroless copper plating using hypophosphite as a reducing agentTaiichi Mizuguchi; Takeshi Kobayashi; Tomoyuki Fujinami; Hideo Honma19981998, vol.49, no.12
Anode behaviors in Sn-Ag alloy plating from ammonium citrate-potassium iodide bathsYutaka Fujiwara; Taeko Narahara; Hidehiko Enomoto; Kiyotaka Funada; Takaski Omi19981998, vol.49, no.12
Bump process technology for LSI waferSoichi Honma; Junichiro Yoshioka; Yoichi Hiruta19981998, vol.49, no.12
Characterization of electrodeposited magnetic nanostructuresYukimi Jyoko; Satoshi Kashiwabara; Yasunori Hayashi19981998, vol.49, no.12
Circuit technologies for 3-D packaging--plating technologies for MIDRikio Komagine19981998, vol.49, no.12
Cross sectional analysis of the microstructure of electroless CoNiP functionally graded magnetic thin filmsYosuke Kita; Takayuki Homma; Tetsuya Osaka19981998, vol.49, no.12
Effect of complexing agents on micro-pattern formation using electroless NiB platingTokihiko Yokoshima; Hiroko Yuasa; Man Kim; Tetsuya Osaka19981998, vol.49, no.12
Electroless palladium plating from monoaminodicarboxylic acid complex bath using formic acid as a reducing agentHidemi Nawafune; Seiichiro Nakao; Shozo Mizumoto; Ei Uchida; Takashi Okada19981998, vol.49, no.12
EMI shielding by electroless platingKenji Nakamura19981998, vol.49, no.12
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