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0915-1869
刊名
表面技術
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表面技术
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1998, vol.49, no.1
1998, vol.49, no.11
1998, vol.49, no.12
1998, vol.49, no.2
1998, vol.49, no.3
1998, vol.49, no.4
1998, vol.49, no.5
1998, vol.49, no.6
1998, vol.49, no.7
1998, vol.49, no.8
1998, vol.49, no.9
1998. vol.49, no.10
题名
作者
出版年
年卷期
Copper deposition system for sub-micron patterning
Kazuhiro Taniguchi
1998
1998, vol.49, no.11
Ebony colored tin-nickel-copper alloy plating
Toshiyuki Nishimura
1998
1998, vol.49, no.11
Electrodeposition of amorphous Co-Zn alloy from ambient-temperature molten salt electrolytes of EMIC system
Nobuyuki Koura; Satoshi Matsumoto; Yasushi Idemoto
1998
1998, vol.49, no.11
Formation of molybdenum silicide by molten salt electrodeposition
Motoi Hara; Tomoyuki Tsuchida
1998
1998, vol.49, no.11
High-rate deposition of CVD-Cu film
Akiko Kobayashi
1998
1998, vol.49, no.11
Investigation of ion migration processes on printed circuit board by quartz crystal microbalance
Sachio Yoshihara
1998
1998, vol.49, no.11
New advanced cu deposition process with long throw sputtering
Kazuo Takakuwa
1998
1998, vol.49, no.11
Patterning of aluminum surface laser irradiation and nickel electrodeposition I. removal of anodic oxide films by laser irradiation
Masatoshi Sakairi; Jun Wakabayashi; Hideaki Takahashi; Yoshihiko ABE; Naoki Katayama
1998
1998, vol.49, no.11
Patterning of aluminum surface with laser irradiation and nickel electrodeposition II. local nickel deposition at laser irradiated area and patterning with fine Ni-Lines
Masatoshi Sakairi; Jun Wakabayashi; Hideaki Takahashi; Yoshihiko ABE; Naoki Katayama
1998
1998, vol.49, no.11
Preparation of semiconductor particles-metal composite films using electroless plating method and their photoelectrochemical properties
Tetsuya Iwagishi; Shinji Yae; Hitoshi Matsuda
1998
1998, vol.49, no.11
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